| 1. | Glass sealed iron - nickel - copper alloy 4j41
玻封铁镍铜合金4j41 |
| 2. | The glass sealed iron - chromium alloy 4j28
玻封铁铬合金4j28 |
| 3. | The dynamic characteristics of the machine pressing glass seal in eq6472 light bus are analysed
摘要对东风轻型客车eq6472前门玻璃密封条气动压装机系统进行了动态特性分析。 |
| 4. | It is with complete cell packing structure , good glass sealing , flat end face internal leads , and dense gloss of coating
管壳结构完整、玻璃封装良好，内引线端面平整，镀层光泽致密。 |
| 5. | Engraving seals : this machine can engrave ox horn seals , organic glass seals , atom seals , plastic seals , and rubber seals
印章制作：能直接雕刻牛角印章，有机玻璃印章，原子印章，塑料印章，橡皮印章等。 |
| 6. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南 |
| 7. | G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.第6 - 8部分:半导体器件包装用表面安装略图制备的一般规则.玻璃密封的陶瓷四方块的设计指南 |
| 8. | G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.第6 - 8部分:表面安装半导体器件封装外形图绘制的一般规则.玻璃密封的陶瓷四边形扁平组件的设计指南 |
| 9. | In this paper , the structure of fed , operation principle of fed and the manufacturing process were presented at first . emphasis of this paper was put on the investigation in low melting - point glass sealing technique and gas exhausting technique
本文首先对fed平板显示器的结构、工作原理、制造工艺过程进行论述，重点论述了对fed平板显示器件的低熔点玻璃封接及除气工艺的研究。 |
